1. Core Definition & Standard Compliance

1.1 Fundamental Overview & Grade Relationships

T2 (C11000/C10100) copper sheet encompasses two key high-purity copper grades, distinguished by oxygen content and production processes:

• T2 (Chinese Grade): A high-purity copper sheet defined by GB/T 2040, with copper content ≥99.90% and controlled oxygen (0.02–0.05%). It is functionally equivalent to ASTM C11000 (ETP copper) and JIS H3100 C1100.

• C11000 (ASTM Grade): Electrolytic Tough-Pitch (ETP) copper, the "workhorse" of high-conductivity copper. Produced via electrolytic refining, it contains 0.02–0.05% oxygen (to enhance machinability) and Cu+Ag ≥99.90%.

• C10100 (ASTM Grade): Oxygen-Free Copper (OFC), ultra-high-purity copper with oxygen content ≤0.001% and Cu+Ag ≥99.99%. Manufactured via vacuum or inert-gas melting to eliminate oxygen, it excels in welding and high-frequency applications.

• Key Nomenclature:

• "T2": "T" = Temper (annealed), "2" = purity/oxygen grade (GB/T system);

• "C11000": "C" = Copper, "11000" = purity/oxygen classification (ASTM/CDA system);

• "C10100": "10100" denotes ultra-low oxygen and maximum purity (OFC).

• Equivalent Grades:

• T2/C11000 Equivalents: JIS H3100 C1100, EN 1976 Cu-ETP, DIN 17660 E-Cu58;

• C10100 Equivalents: JIS H3100 C1020 (OFC), EN 1976 Cu-OF, GB/T 2040 TU2 (Chinese oxygen-free copper).

1.2 Core Standards

• Primary Standards: GB/T 2040 (T2, China), ASTM B152 (C11000/C10100 sheet/plate), ASTM B153 (strip), JIS H3100 (Japan), EN 1976 (Europe);

• Quality Certifications: ISO 9001, ISO 14001, CE, and third-party certifications (SGS, BV, TÜV) for export markets;

• Purity & Oxygen Requirements:

• T2/C11000: Cu+Ag ≥99.90%, O = 0.02–0.05%, P ≤0.005%;

• C10100: Cu+Ag ≥99.99%, O ≤0.001%, total impurities ≤0.01%.

2. Chemical Composition

The primary difference between T2/C11000 and C10100 lies in oxygen content and impurity levels, which directly impact weldability, conductivity, and embrittlement resistance (mass fraction, %; per ASTM B152/GB/T 2040):

Key Alloy Advantage

• T2/C11000: Balances high conductivity (≥100% IACS) with cost-effectiveness and machinability, making it ideal for general high-conductivity applications;

• C10100: Ultra-high purity and zero oxygen enable superior weldability, resistance to hydrogen embrittlement, and marginally higher conductivity (≥101% IACS), suited for critical precision applications.

3. Mechanical & Physical Properties

T2/C11000 and C10100 share similar mechanical properties but differ in conductivity and environmental resistance. Below are typical values for 0.5–6.0mm thick sheet (annealed temper):

Performance Note

• Thickness Impact: Thinner sheets (<1.0mm) exhibit slightly higher tensile strength (+10–15MPa) due to cold working; thicker sheets (>6.0mm) maintain ductility but require longer annealing;

• Temperature Sensitivity: Conductivity remains stable between -200°C and 200°C; C10100 retains performance better at temperatures >300°C.

4. Product Forms & Dimensional Range

T2/C11000 and C10100 copper sheets are supplied in flexible configurations to meet diverse industrial needs, with precise dimensional controls:

4.1 Core Product Forms

• Copper Sheet/Plate: Flat sheets for cutting, stamping, and fabrication (0.5–50mm thick);

• Copper Coil/Strip: Continuous coils for high-volume production (0.01–3.0mm thick, up to 500m length);

• Precision Blanks: Custom-cut shapes for immediate use in electronics and machinery;

• Foil: Ultra-thin sheets (0.01–0.1mm) for shielding, circuit boards, and micro-components.

4.2 Dimensional Range

• Thickness: 0.01mm (foil)–50mm (heavy plate); common industrial gauges: 0.5mm, 1mm, 2mm, 3mm, 6mm, 10mm, 20mm;

• Width: Standard 1000mm, 1220mm, 1500mm, 2000mm; customized up to 3000mm;

• Length: Sheets 1000mm–6000mm; coils up to 500m (varies by thickness);

• Dimensional Tolerance: Thickness ±0.01mm (foil) to ±0.1mm (plate); width ±1mm (standard); length ±2mm (standard).

4.3 Surface Quality & Treatments

Both grades support multiple surface finishes to suit application requirements:

Surface Treatment Options

• Annealing: 650–700°C for 2–4 hours (T2/C11000) or 700–750°C for 3–5 hours (C10100) to restore ductility;

• Passivation: Forms a protective film to prevent tarnishing during storage/transport;

• Tin Plating: Thin tin coating (2–5μm) to enhance solderability for electronic components;

• Nickel Plating: Improves corrosion resistance for harsh environments (e.g., marine use);

• Polishing: Mechanical or chemical polishing for decorative and high-contact applications.

5. Production Process & Quality Control

T2/C11000 and C10100 require precision manufacturing, with key differences in oxygen control:

1. Raw Material Preparation:

• T2/C11000: High-purity copper ingots (≥99.95%) from electrolytic refining;

• C10100: Ultra-pure copper cathodes (≥99.99%) processed via vacuum or inert-gas melting.

2. Melting & Casting:

• T2/C11000: Air-melted in induction furnaces; controlled oxygen addition (0.02–0.05%);

• C10100: Vacuum-melted (10⁻³–10⁻⁴ Pa) to eliminate oxygen; continuous casting into ingots.

3. Hot Rolling: Ingots heated to 800–900°C, hot-rolled to intermediate thickness (10–20mm);

4. Cold Rolling: 3–5 passes of precision cold rolling to target thickness (0.01–50mm); tolerance controlled to ±0.01mm for thin sheets;

5. Annealing: Continuous annealing to achieve soft temper and maximum ductility;

6. Surface Treatment: Pickling (oxide scale removal), polishing, or plating per customer requirements;

7. Quality Inspection:

• Chemical Testing: Spectrometric analysis (ASTM E1086) to verify purity and oxygen content;

• Mechanical Testing: Tensile, bend, and hardness tests for each batch;

• Conductivity Testing: Eddy current testing (≥100% IACS for C11000, ≥101% IACS for C10100);

• Non-Destructive Testing (NDT): Ultrasonic testing (UT) for internal defects; optical scanning for surface flaws;

• Oxygen Content Testing: Inert gas fusion (IGF) for C10100 (≤0.001%).

6. Core Applications

T2/C11000 and C10100 are tailored to distinct but overlapping applications, based on purity and oxygen content:

6.1 T2/C11000 (ETP Copper): Ideal For…

• Electrical Engineering: Bus bars, power cables, transformer windings, switchgear components;

• Electronics: Circuit board traces, connectors, battery terminals (high conductivity + cost-effectiveness);

• Thermal Management: Heat exchangers, radiators, HVAC coils (superior thermal transfer);

• Architecture & Construction: Decorative panels, roof cladding, plumbing pipes (corrosion resistance + aesthetic appeal);

• General Manufacturing: Stamped parts, gaskets, valves, and welded assemblies (balanced formability and machinability).

6.2 C10100 (OFC Copper): Ideal For…

• High-Frequency Electronics: RF connectors, coaxial cables, waveguides (low signal loss);

• Aerospace & Defense: Aircraft wiring, satellite components, rocket engine cooling tubes (weldability + embrittlement resistance);

• Medical Equipment: Implantable devices, surgical instruments (biocompatibility + ultra-purity);

• Precision Welding: Critical welded assemblies (no oxygen-induced porosity);

• Ultra-High-Precision Applications: Semiconductor manufacturing tools, cryogenic equipment (stable performance in extreme conditions).

7. Comparison with Similar Grades & Materials

7.1 T2/C11000 vs. C10100

7.2 T2/C11000 vs. T1 Copper

• T1: Full annealed (softer, HB 30–35), elongation ≥48%, suited for ultra-complex forming;

• T2/C11000: Slightly higher strength (HB 35–45), cost-effective alternative for most applications.

7.3 T2/C11000 vs. Brass (H62)

• T2/C11000: Higher conductivity (100% vs. 28% IACS), better thermal transfer, superior ductility;

• H62 Brass: Lower cost, higher strength, better corrosion resistance in saltwater; less suitable for electrical applications.

8. Cost & Pricing Considerations (2025 Q4 Data)

Pricing for T2/C11000 and C10100 is driven by copper commodity prices, purity, thickness, and order volume:

8.1 Global Price Ranges

8.2 Key Pricing Drivers

• Commodity Prices: LME copper prices account for 70–80% of total cost (2025 Q4: ~$8,500/ton);

• Purity Premium: C10100 costs 15–30% more than C11000 due to ultra-purity and vacuum processing;

• Thickness: Ultra-thin foil (≤0.1mm) costs 30–50% more than standard sheets (1–6mm);

• Order Volume: Bulk orders (≥5 tons) unlock 10–15% discounts vs. small orders (<1 ton);

• Surface Treatment: Polished/plated sheets cost 15–30% more than mill finish.

8.3 Cost Optimization Strategies

• Grade Selection: Use T2/C11000 for non-critical applications (saves 15–30% vs. C10100);

• Bulk Purchasing: Orders ≥5 tons reduce costs via manufacturer direct pricing;

• Standard Sizes: Opt for common dimensions (1220×2440mm, 1500×3000mm) to avoid custom cutting premiums;

• Domestic Sourcing: Chinese-manufactured grades offer 20–30% cost savings vs. Western suppliers with comparable quality.

9. Supply Chain & Value-Added Services

• Minimum Order Quantity (MOQ): 100kg (T2/C11000 standard sheets); 500kg (C10100/custom sizes);

• Delivery Lead Time: 7–14 days (stock T2/C11000); 15–30 days (stock C10100); 25–45 days (custom orders);

• Packaging: Seaworthy export packaging (moisture-proof plastic film + kraft paper + wooden pallets); C10100 vacuum-sealed to prevent oxidation;

• Value-Added Services: Precision cutting (laser/plasma), bending, welding, plating, and third-party testing (SGS/BV); additional 5–20% cost;

• Global Supply Hubs: Core production bases in China (Shanghai, Jiangsu), USA (Ohio, Texas), and Europe (Germany, Italy); loading ports cover major logistics hubs.

10. Conclusion

T2 (C11000/C10100) copper sheet represents the gold standard for high-purity, high-conductivity applications, offering a spectrum of options to balance performance and cost. T2/C11000 (ETP copper) excels as the cost-effective workhorse for general electrical, thermal, and architectural needs, while C10100 (OFC copper) delivers ultra-purity and embrittlement resistance for critical aerospace, medical, and high-frequency applications.

Both grades leverage pure copper’s inherent advantages — exceptional conductivity, ductility, and corrosion resistance — making them indispensable across industries where reliability and efficiency are non-negotiable. Backed by global standards, strict quality control, and a flexible supply chain, T2 (C11000/C10100) copper sheet remains the top choice for engineers and buyers seeking versatile, high-performance materials. By aligning grade selection with application requirements, users can maximize value while ensuring optimal performance.