1. Core Definition & Standard Compliance

1.1 Fundamental Overview

T1 (C11000) copper sheet is a high-purity non-alloy copper product classified as "Electrolytic Tough-Pitch (ETP) copper"—a designation reflecting its production via electrolytic refining (for purity) and controlled oxygen content (0.02–0.05%). Its naming and classification follow global standards:

• Grade Nomenclature:

• C11000: ASTM/CDA (Copper Development Association) designation; denotes 99.90%+ Cu content with trace oxygen.

• T1: Temper designation (per ASTM B601) – "Full annealed" state (softest temper), delivering maximum ductility and formability.

• Key Aliases: ETP Copper, Red Copper (due to its natural reddish hue), High-Conductivity Copper.

• Equivalent Grades:

• ASTM: C10100 (oxygen-free, higher purity), C10200 (oxygen-free low-residual phosphorus);

• JIS: H3100 C1100 (Japanese equivalent);

• EN: Cu-ETP (European standard, EN 1976);

• GB/T: T2 copper (Chinese equivalent, slight oxygen content difference).

• Temper Distinction (T1 vs. T2/T3):

• T1: Full annealed (650–700°C), softest (HRB 30–40), highest elongation (≥45%); ideal for complex forming.

• T2: Cold-worked + partial annealed, moderate strength; cost-effective alternative for non-critical applications.

• T3: Cold-worked, highest strength but lower ductility; suited for structural parts.

1.2 Core Standards

• Primary Standards: ASTM B152 (sheet/plate), ASTM B153 (strip), JIS H3100, EN 1976, GB/T 2040;

• Quality Certifications: ISO 9001, ISO 14001, CE, and third-party certifications (SGS, BV, TÜV) for export markets;

• Purity Requirements: Minimum Cu + Ag content ≥99.90% (ASTM B152), with strict impurity control (O ≤0.05%, P ≤0.005%).

2. Chemical Composition

T1 (C11000) copper sheet’s high-purity formulation is optimized for conductivity and ductility, with stringent limits on impurities that could degrade performance (mass fraction, %; per ASTM B152):

Key Alloy Advantage

The ultra-high copper purity (≥99.90%) eliminates barriers to electron flow, resulting in electrical conductivity approaching the theoretical maximum for copper (101% IACS). Controlled oxygen content balances machinability and ductility, making T1 suitable for both precision forming and machining.

3. Mechanical & Physical Properties

T1 (C11000) copper sheet’s performance is defined by its soft, ductile nature and exceptional conductive properties—typical values for 0.5–6.0mm thick sheet (T1 temper, ASTM B152 compliant):

Performance Note

• Thickness Impact: Thinner sheets (<1.0mm) exhibit slightly higher tensile strength (+10–15MPa) due to cold working during rolling; thicker sheets (>6.0mm) maintain consistent ductility but may require longer annealing.

• Temperature Sensitivity: Conductivity remains stable between -200°C and 200°C; above 300°C, conductivity gradually decreases but remains superior to most alloys.

4. Product Forms & Dimensional Range

T1 (C11000) copper sheet is supplied in flexible configurations to meet diverse industrial needs, with precise dimensional controls:

4.1 Core Product Forms

• Copper Sheet/Plate: Flat sheets for cutting, stamping, and fabrication;

• Copper Coil/Strip: Continuous coils for high-volume production (e.g., electrical connectors, gaskets);

• Precision Blanks: Custom-cut shapes for immediate use in manufacturing;

• Foil: Ultra-thin sheets (0.01–0.1mm) for electronic components and shielding.

4.2 Dimensional Range

• Thickness: Standard 0.01mm (foil)–20mm (plate); common industrial gauges: 0.5mm, 1mm, 2mm, 3mm, 6mm, 8mm;

• Width: Standard 1000mm, 1220mm, 1500mm; customized up to 3000mm;

• Length: Sheets 1000mm–6000mm; coils up to 500m (depending on thickness);

• Dimensional Tolerance: Thickness ±0.01mm (foil) to ±0.1mm (plate); width ±1mm (standard); length ±2mm (standard).

4.3 Surface Quality & Treatments

T1 (C11000) copper sheet’s surface quality is tailored to application requirements, with common finishes and treatments:

Surface Treatment Options

• Annealing: Full annealing (650–700°C for 2–4 hours) to restore ductility after cold working;

• Passivation: Forms a protective film to prevent tarnishing during storage/transport;

• Tin Plating: Thin tin coating (2–5μm) to enhance solderability for electronic components;

• Nickel Plating: Improves corrosion resistance for harsh environments (e.g., marine applications);

• Oxide Coating: Black oxide finish for decorative or heat-resistant applications.

5. Production Process & Quality Control

T1 (C11000) copper sheet undergoes a precision manufacturing process to ensure high purity and consistent performance:

1. Raw Material Refining: Copper ore is smelted and electrolytically refined to ≥99.99% purity (electrolytic refining removes impurities via electroplating);

2. Casting: Refined copper is cast into ingots or billets via continuous casting; homogenization annealing (700–750°C) eliminates segregation;

3. Hot Rolling: Ingots heated to 800–900°C are hot-rolled to intermediate thickness (10–20mm);

4. Cold Rolling: 3–5 passes of precision cold rolling to achieve target thickness (0.01–20mm); thickness tolerance controlled to ±0.01mm for thin sheets;

5. Full Annealing: Continuous annealing at 650–700°C for 2–4 hours to eliminate work hardening, refine grain structure, and achieve T1 temper;

6. Surface Treatment: Pickling (to remove oxide scale), polishing, or plating based on customer requirements;

7. Quality Inspection:

• Chemical Testing: Spectrometric analysis (ASTM E1086) to verify copper purity and impurity content;

• Mechanical Testing: Tensile, bend, and hardness tests for each production batch;

• Conductivity Testing: Eddy current testing to confirm electrical conductivity (≥100% IACS);

• Surface Inspection: 100% visual inspection + automated optical scanning for defects (scratches, pits, tarnish);

• Dimensional Testing: Laser measurement for thickness, width, and flatness.

6. Core Applications

T1 (C11000) copper sheet’s unique combination of high conductivity, ductility, and corrosion resistance makes it indispensable across industries:

6.1 Electrical & Electronic Industry

• Electrical conductors (bus bars, power cables, transformer windings);

• Electronic components (circuit board traces, connectors, heat sinks);

• Battery terminals and electrical contacts (high conductivity ensures low energy loss);

• Rationale: Near-maximum electrical conductivity minimizes resistance and heat generation.

6.2 Thermal Management

• Heat exchangers, radiators, and cooling plates (e.g., automotive, industrial machinery);

• HVAC systems (copper tubing, heat transfer fins);

• Rationale: Superior thermal conductivity (391 W/m·K) enables efficient heat dissipation.

6.3 Architecture & Construction

• Decorative panels, roof cladding, and gutters (natural reddish hue develops a patina over time);

• Plumbing fixtures and pipes (corrosion resistance and bacteriostatic properties);

• Rationale: Aesthetic appeal, durability (50+ year service life), and resistance to atmospheric corrosion.

6.4 Manufacturing & Fabrication

• Precision stamped parts (gaskets, washers, connectors);

• Deep-drawn components (containers, valves, fittings);

• Welded assemblies (due to excellent weldability);

• Rationale: Exceptional ductility and formability enable complex shapes without cracking.

6.5 Other Critical Applications

• Medical equipment (bacteriostatic properties and biocompatibility);

• Marine components (corrosion resistance to saltwater);

• Telecommunications (waveguides, coaxial cables);

• Rationale: Purity and performance reliability for safety-critical and high-precision use cases.

7. Comparison with Similar Grades & Materials

7.1 T1 (C11000) vs. Other Copper Tempers

7.2 T1 (C11000) vs. Oxygen-Free Copper (C10100)

• T1 (C11000): Contains 0.02–0.05% oxygen; lower cost, better machinability; suitable for most electrical/thermal applications;

• C10100 (OFC): ≤0.001% oxygen; higher conductivity (≥101% IACS), superior weldability; used for high-frequency applications (e.g., aerospace wiring); 15–20% higher cost than T1.

7.3 T1 (C11000) vs. Brass (C26000)

• T1 Copper: Higher conductivity (100% vs. 28% IACS), better thermal transfer, superior ductility;

• Brass: Higher strength, lower cost, better corrosion resistance to saltwater; used for valves, fittings, and decorative parts; less suitable for electrical applications.

8. Cost & Pricing Considerations (2025 Q4 Data)

T1 (C11000) copper sheet pricing is influenced by copper commodity prices, purity, thickness, and order volume:

8.1 Global Price Ranges

8.2 Key Pricing Drivers

• Copper Commodity Price: Accounts for 70–80% of total cost; linked to LME copper prices (2025 Q4: ~$8,500/ton);

• Purity: T1 (99.90% Cu) costs 5–10% more than T2 (99.80% Cu);

• Thickness: Ultra-thin foil (≤0.1mm) costs 30–50% more than standard sheets (1–6mm) due to precision rolling;

• Order Volume: Bulk orders (≥5 tons) unlock 10–15% discounts vs. small orders (<1 ton);

• Surface Treatment: Polished or plated sheets cost 15–30% more than mill finish.

8.3 Cost Optimization Strategies

• Bulk Purchasing: Orders ≥5 tons reduce costs by 10–15% via manufacturer direct pricing;

• Standard Sizes: Opt for common dimensions (1220×2440mm, 1500×3000mm) to avoid custom cutting premiums (15–20%);

• Temper Selection: Use T2 instead of T1 for non-critical applications (saves 5–10% without significant conductivity loss);

• Domestic Sourcing: Chinese-manufactured T1 copper offers 20–30% cost savings vs. Western suppliers with comparable quality.

9. Supply Chain & Value-Added Services

• Minimum Order Quantity (MOQ): 100kg (standard sheets); 500kg (custom sizes/finishes);

• Delivery Lead Time: 7–14 days (stock products); 25–40 days (custom orders, including annealing/plating);

• Packaging: Seaworthy export packaging (moisture-proof plastic film + kraft paper + wooden pallets) to prevent tarnishing; foil products vacuum-sealed;

• Value-Added Services: Precision cutting (laser/plasma), bending, welding, plating, and third-party testing (SGS/BV); additional 5–20% cost;

• Global Supply Hubs: Core production bases in China (Shanghai, Jiangsu), USA (Ohio, Texas), and Europe (Germany, Italy); loading ports cover major global logistics hubs.

10. Conclusion

T1 (C11000) copper sheet stands as the gold standard for high-purity, high-conductivity copper applications, offering unmatched electrical/thermal performance and exceptional ductility. Its compliance with global standards (ASTM B152, JIS H3100) and strict quality controls make it the preferred choice for electrical, electronic, architectural, and manufacturing industries where reliability and efficiency are critical.

While T1 commands a premium over lower-purity copper or brass, its performance benefits—low energy loss, easy forming, and long service life—justify the investment for high-value applications. For cost-sensitive projects, T2 copper provides a viable alternative, while oxygen-free copper (C10100) is recommended for ultra-high-precision electrical use cases.

Backed by a global supply chain, flexible product configurations, and value-added services, T1 (C11000) copper sheet remains the top choice for engineers and buyers seeking a versatile, high-performance material that balances conductivity, ductility, and durability.